[1] | J. Leitner, A. Strejc, D. Sedmidubsky, K. Ruzi, “High temperature enthalpy and heat capacity of GaN,” Thermochimica Acta 401, 169-173 (2003). |
|
[2] | Z. Linli, L. Haonan, “On the role of piezoelectricity in phonon properties and thermal conductivity of GaN nanofilms,” Theoretical and Applied Mechanics Letters 6, 277-281 (2016). |
|
[3] | J. Zolper, “A review of junction field effect transistors for high-temperature and high power electronics,” Solid State Electron 42, 2153-2156 (1998). |
|
[4] | M. Alim, M. Ali, A. Rezazadeh, C. Gaquiere, “Thermal response for intermodulation distortion components of GaN HEMT for low and high frequency applications,” Microelectronic Engineering 209, 53-59 (2019). |
|
[5] | S. Sze, K. Ng, “Physics of Semiconductor Devices,” John Wiley & Sons, (2006). |
|
[6] | M. Gassoumi, A. Helal, H. Maaref, M. Gassoumi, “DC and RF characteristics optimization of AlGaN/GaN/BGaN/GaN/Si HEMT for microwave-power and high temperature application,” Results in Physics 12, 302-306 (2019). |
|
[7] | A. Azarifar, N. Donmezer, “Multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs,” Microelectronics Reliability 74, 82-87 (2017). |
|
[8] | Y. Wu, M. Jacob-Mitos, M. Moore, S. Heikman, “A 97.8% efficient GaN HEMT boost converter with 300-W output power at 1 MHz,” IEEE Electron Device Letters 29, 824-826 (2008). |
|
[9] | C. Lee, W. Lin, Y. Lee, J. Huang, “Characterizations of enhancement-mode double heterostructure GaN HEMTs with gate field plates,” IEEE Transactions on Electron Devices 65, 488-492 (2018). |
|
[10] | M. Yanagihara, Y. Uemoto, T. Ueda, T. Tanaka, D. Ueda, “Recent advances in GaN transistors for future emerging applications,” Physica Status Solidi A 206, 1221-1227 (2009). |
|
[11] | T. Chow, V. Khemka, J. Fedison, N. Ramungul, K. Matocha, Y. Tang, R. Gutmann, “SiC and GaN bipolar power devices,” Solid State Electronics 44, 277-301 (2000). |
|
[12] | Q. Hao, H. Zhao, Y. Xiao, M. Brandon, “Electrothermal studies of GaN based high electron mobility transistors with improved thermal designs,” International Journal of Heat and Mass Transfer 116, 496-506 (2018). |
|
[13] | S. Chander, S. Gupta, Ajay, M. Gupta, “Enhancement of breakdown voltage in AlGaN/GaN HEMT using passivation technique for microwave application,” Superlattices and Microstructures 120, 217-222 (2018). |
|
[14] | Z. Li, C. Li, D. Peng, D. Zhang, X. Dong, L. Pan, W. Luo, L. Li, Q. Yang, “Growth of quaternary InAlGaN barrier with ultrathin thickness for HEMT application,” Superlattices and Microstructures 118, 213-220 (2018). |
|
[15] | U. Mishra, P. Parikh, Y. Wu, “AlGaN/GaN HEMTs: an overview of device operation and applications,” Proceedings of the IEEE 90, 1022-1031 (2002). |
|
[16] | O. Ambacher, J. Smart, J. Shealy, N. Weimann, K. Chu, M. Murphy, W. chaff, L. Eastman, R. Dimitrov, L. Wittmer, M. Stutzmann, W. Rieger, J. Hilsenbeck, “Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AIGaN/GaN heterostructures,” Journal of Applied Physics 85, 3222-3233 (1999). |
|
[17] | G. Grecoa, F. Iucolanob, F. Roccaforte, “Review of technology for normally-off HEMTs with p-GaN gate,” Materials Science in Semiconductor Processing 78, 96-106 (2018). |
|
[18] | G. Haijun, D. Baoxing, W. Hao, Y. Yintang, “Analytical model of AlGaN/GaN HEMTs with a partial GaN cap layer,” Superlattices and Microstructures 123, 210-217 (2018). |
|
[19] | D. Panda, T. Lenka, “Oxide thickness dependent compact model of channel noise for E-mode AlGaN/GaN MOS-HEMT,” International Journal of Electronics and Communications 82, 467-473 (2017). |
|
[20] | A. Chvala, J. Marek, P. Pribytnya, A. Satka, S. Stoffels, N. Posthuma, S. Decoutere, D. Donoval, “Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation,” Microelectronics Reliability 78, 148-155 (2017). |
|
[21] | A. Mojab, Z. Hemmat, H. Riazmontazer, A. Rahnamaee, “Introducing optical cascode GaN HEMT,” IEEE Transactions on Electron Devices 64, 796-804 (2017). |
|
[22] | S. Faramehr, K. Kalna, P. Igic, “Drift-diffusion and hydrodynamic modeling of current collapse in GaN HEMTs for RF power application,” Semiconductor Science and Technology 29, 025007-025017 (2014). |
|
[23] | J. Vobecky, “The current status of power semiconductors,” Facta University Series Electron Energy 28, 193-203 (2015). |
|
[24] | B. Ubochi, S. Faramehr, K. Ahmed, P. Igic, K. Kalna, B. Ubochi, “Induced trapping in scaled GaN HEMTs,” Microelectronics Reliability 71, 35-40 (2017). |
|
[25] | S. Razavi, S. Pour, P. Najari, “New GaN based HEMT with Si3N4 or un-doped region in the barrier for high power applications,” Superlattices and Microstructures 118, 221-229 (2018). |
|
[26] | H. Zhang, P. Ma, Y. Lu, B. Zhao, J. Zheng, X. Ma, Y. Hao, “Extraction method for parasitic capacitances and inductances of HEMT models,” Solid State Electronics 129, 108-113 (2017). |
|
[27] | A. Chini, F. Soci, M. Meneghini, G. Meneghesso, E. Zanoni, “Deep levels characterization in GaN HEMTs-Part II: experimental and numerical evaluation of self-heating effects on the extraction of traps activation energy,” IEEE Transactions on Electron Devices 60, 3176-3182 (2013). |
|
[28] | J. Joh, L. Xia, J. Alamo, “Gate current degradation mechanisms of GaN high electron mobility transistors,” in Proceedings IEDM, 385-388 (2007). |
|
[29] | M. Mocanu, C. Unger, M. Pfost, P. Waltereit, R. Reiner, “Thermal stability and failure mechanism of Schottky gate AlGaN/GaN HEMTs,” IEEE Transactions on Electron Devices 64, 848-855 (2017). |
|
[30] | G. Meneghesso, G. Verzellesi, F. Rampazzo, F. Zanon, A. Tazzoli, M. Meneghini, E. Zanoni, “Reliability of GaN high electron mobility transistors: state of the art and perspectives,” IEEE Transactions on Device & Materials Reliability 8, 332-343 (2008). |
|
[31] | L. Yen-Ku, N. Shuichi, L. Hsiao-Chieh, L. Shih-Chien, W. Chia-Hsun, W. Yuen-Yee, L. Quang, H. Chang, P. Hsu, H. Samukawa, S. Chang, E. Yi, “AlGaN/GaN HEMTs with damage-free neutral beam etched gate recess for high performance millimeter wave applications,” IEEE Electron Device Letters 37, 1395-1398 (2016). |
|
[32] | Z. Lei, H. Guoc, M. Tanga, C. Zeng, Z. Zhang, H. Chen, Y. Enb, Y. Huang, Y. Chen, C. Peng, “Degradation mechanisms of AlGaN/GaN HEMTs under 800 MeV Bi ions irradiation,” Microelectronics Reliability 80, 312-316 (2018). |
|
[33] | H. Lee, M. Bae, S. Jo, J. Shin, D. Son, C. Won, H. Jeong, J. Lee, S. Kang, “AlGaN/GaN high electron mobility transistor based biosensor for the detection of C-reactive protein,” Sensors 15, 18416-18426 (2015). |
|
[34] | S. Indu, R. Abiral, C. Yen-Wen, H. Chen-Pin, C. Pei-chi, C. Wen-Hsin, L. Geng-Yen, C. Jen-Inn, S. Shu-Chu, L. Gwo-Bin, W. Yu-Lin, “High sensitivity cardiac troponin I detection in physiological environment using AlGaN/GaN high electron mobility transistor biosensors,” Biosensors and Bioelectronics 100, 282-289 (2018). |
|
[35] | A. Fletcher, D. Nirmal, “Review a survey of Gallium Nitride HEMT for RF and high power applications,” Superlattices and Microstructures 109, 519-537 (2017). |
|
[36] | N. Takuma, M. Tsukasa, I. Akihumi, S. Yosuke, S. Katsuomi, S. Muneyoshi, O. Toshiyuki, A. Yuji, Y. Eiji, Y. Kiichi, T. Yasunori, “Enhancement of drain current by an AlN spacer layer insertion in AlGaN/GaN high electron mobility transistors with Si-Ion-Implanted source/drain contacts,” Japanese Journal of Applied Physics 50, 064101 (2011). |
|
[37] | M. Wosko, B. Paszkiewicz, R. Paszkiewicz, M. Tlaczala, “Influence of AlN spacer on the properties of AlGaN/AlN/GaN heterostructures,” Applied Optics 43, 61-66 (2013). |
|
[38] | B. Benbakhti, A. Soltani, K. Kalna, M. Rousseau, J. De Jaeger, “Effects of self-heating on performance degradation in AlGaN/GaN based devices,” IEEE Transactions on Electron Devices 56, 2178-2185 (2009). |
|
[39] | X. Zheng, S. Feng, Y. Zhang, J. Li, “Evaluation of the Schottky contact degradation on the temperature transient measurements in GaN HEMTs,” IEEE Transactions on Electron Devices, 65, 1734-1738, (2018). |
|
[40] | S. Binari, W. Kruppa, H. Dietrich, G. Kelner, A. Wickenden, J. Freitas, “Fabrication and characterization of GaN FETs,” Solid State Electronics 41, 1549-1554 (1997). |
|
[41] | C. Nguyen, N. Nguyen, D. Grider, “Drain current compression in GaN MODFETs under large-signal modulation at microwave frequencies,” Electronics Letters 35, 1380 (1999). |
|
[42] | M. Gonschorek, J. Carlin, E. Feltin, M. Py, N. Grandjean, “High electron mobility lattice-matched AlInN/GaN field effect transistor heterostructures,” Applied Physics Letters 89, 062106 (2006). |
|
[43] | J. Freedsman, A. Watanabe, Y. Urayama, T. Egawa, “Enhanced two dimensional electron gas transport characteristics in Al2O3/AlInN/GaN metal-oxide semiconductor high electron mobility transistors on Si substrate,” Applied Physics Letters 107, 103506 (2015). |
|
[44] | Z. Fang, B. Claflin, D. Look, D. Green, R. Vetury, “Deep traps in AlGaN/GaN heterostructures studied by deep level transient spectroscopy: effect of carbon concentration in GaN buffer layers,” Journal of Applied Physics 108, 063706 (2010). |
|
[45] | E. Miller, X. Dang, H. Wieder, P. Asbeck, E. Yu, G. Sullivan, J. Redwing, “Trap characterization by gate-drain conductance and capacitance dispersion studies of an AlGaN/GaN heterostructure field effect transistor,” Journal of Applied Physics 87, 8070 (2000). |
|
[46] | D. Park, M. Kim, K. Beom, S. Cho, C. Kang, T. Yoon, “Reversible capacitance changes in the MOS capacitor with an ITO/CeO2/p-Si structure,” Journal of Alloys and Compounds 786, 655-661 (2019). |
|
[47] | R. Herbert, Y. Hwang, S. Stemmer, “Comparison of methods to quantify interface trap densities at dielectric/III-V semiconductor interfaces,” Journal of Applied Physics 108, 124101 (2010). |
|
[48] | J. Zhu, X. Ma, B. Hou, W. Chen, H. Yue, “Investigation of trap states in high Al content AlGaN/GaN high electron mobility transistors by frequency dependent capacitance and conductance analysis,” AIP Advances 4, 371081-371087 (2014). |
|
[49] | A. Chakraborty, D. Biswas, “Comparison of trap characteristics between AlGaN/GaN and AlGaN/InGaN/GaN heterostructure by frequency dependent conductance measurement,” Applied Physics Letters 106, 082112 (2015). |
|
[50] | S. Latrach, E. Frayssinet, N. Defrance, S. Chenot, Y. Cordier, C. Gaqui, H. Maaref, Trap states analysis in AlGaN/AlN/GaN and InAlN/AlN/GaN high electron mobility transistors,” Current Applied Physics 17, 1601-1608 (2017). |
|
[51] | R. Quay, “Gallium Nitride Electronics”, Springer Science & Business Media 96 (2008). |
|
[52] | A. Hitoshi, S. Hiroyuki, K. Naotaka, N. Yohei, C. Kentaro, N. Ken, “AlGaN/GaN MIS HEMT modeling of frequency dispersion and self-heating effects,” 2018 IEEE International Symposium on Radio Frequency Integration Technology (RFIT) Radio Frequency Integration Technology (RFIT),1-3 Aug (2018). |
|
[53] | A. Darwish, A. Bayba, H. Hung, “Thermal resistance calculation of AlGaN-GaN devices,” IEEE Transactions on Microwave Theory and Techniques 52, 2611-2620 (2004). |
|
[54] | J. Kuzmik, P. Javorka, A. Alam, M. Marso, M. Heuken, P. Kordos. “Determination of channel temperature in AlGaN/GaN HEMTs grown on sapphire and silicon substrates using DC characterization method,” IEEE Transactions on Electron Devices 49, 1496-1498 (2002). |
|
[55] | R. Menozzi, G. Membreno, B. Nener, G. Parish, G. Sozzi, L. Faraone, “Temperature-dependent characterization of AlGaN/GaN HEMTs: thermal and source/drain resistances,” IEEE Transactions on Device and Materials Reliability 8, 255-264 (2008). |
|
[56] | H. Zhu, X. Meng, X. Zheng, Y. Yang, S. Feng, Y. Zhang, G. Chunsheng, “Review: Effect of substrate thinning on the electronic transport characteristics of AlGaN/GaN HEMTs,” Solid State Electronics 145, 40-45 (2018). |
|
[57] | R. White, “GaN: The challenges ahead,” IEEE Power Electronics Magazine 1, 54-56 (2014). |
|
[58] | Z. Tang, Q. Jiang, Y. Lu, S Huang, S. Yang, X. Tang, K. Chen, “600-V normally Off SiNx/AlGaN/GaN MIS-HEMT with large gate swing and low current collapse,” IEEE Electron Device Letters 34, 1373-1375 (2013). |
|
[59] | W. Saito, Y. Takada, M. Kuraguchi, K. Tsuda, I. Omura, “Recessed gate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications,” IEEE Transaction on Electron Devices 53, 356-362 (2006). |
|
[60] | S. Burnham, K. Boutros, P. Hashimoto, C. Butler, D. Wong, M. Hu, M. Micovic, “Gate-recessed normally-off GaN-on-Si HEMT using a new O2-BCl3 digital etching technique,” Physics Status Solidi C 7, 2010-2012 (2010). |
|
[61] | C. Chang, S. Pearton, C. Lo, F. Ren, I. Kravchenko, A. Dabiran, A. Wowchak, B. Cui, P. Chow, “Development of enhancement mode AlN/GaN high electron mobility transistors,” Applied Physics Letters 94, 263505 (2009). |
|
[62] | L. Su, F. Lee, J. Huang, “Enhancement-mode GaN-based high electron mobility transistors on the Si substrate with a p-type GaN cap layer,” IEEE Transactions on Electron Devices 61, 460-465 (2014). |
|
[63] | Y. Yadav, B. Upadhyay, M. Meer, N. Bhardwaj, S. Ganguly, D. Saha, “Ti/Au/Al/Ni/Au low contact resistance and sharp edge acuity for highly scalable AlGaN/GaN HEMTs,” IEEE Electron Device Letters 40, 67-70 (2019). |
|
[64] | S. Ghosh, A. Dasgupta, S. Khandelwal, S. Agnihotri, Y. Chauhan, “Surface potential-based compact modeling of gate current in AlGaN/GaN HEMTs,” IEEE Transactions on Electron Devices 62, 443-448 (2015). |
|
[65] | B. Padmanabhan, D. Vasileska, S. Goodnick, “Is self-heating responsible for the current collapse in GaN HEMTs,” Journal of Computational Electronics 11, 129-36 (2012). |
|
[66] | N. Ahmed, A. Dutta, “Analytical models for the 2DEG concentration and gate leakage current in AlGaN/GaN HEMTs,” Solid State Electronics 132, 64-72 (2017). |
|
[67] | S. Dinara, S. Jana, S. Ghosh, P. Mukhopadhyay, R. Kumar, A. Chakraborty, S. Bhattacharya, D. Biswas, “Enhancement of two dimensional electron gas concentrations due to Si3N4 passivation on Al0.3Ga0.7N/GaN heterostructure: Strain and interface capacitance analysis,” AIP Advices 5, 047136 (2015). |
|
[68] | D. Nirmal, L. Arivazhagan, A. Augustine Fletcher, J. Ajayan, P. Prajoon, “Current collapse modeling in AlGaN/GaN HEMT using small signal equivalent circuit for high power application,” Superlattices and Microstructures 113, 810-820 (2018). |
|
[69] | T. Liua, C. Jianga, X. Huang, C. Dua, Z. Zhaoa, L. Jinga, X. Lia, S. Hana, J. Suna, X. Pua, J. Zhaia, W. Hu, “Electrical transportation and piezotronic-effect modulation in AlGaN/GaN MOS HEMTs and un-passivated HEMTs,” Nano Energy 39, 53-59 (2017). |
|
[70] | S. Arulkumaran, T. Egawa, H. Ishikawa, T. Jimbo, “Temperature dependence of gate leakage current in AlGaN/GaN high electron mobility transistors,” Applied Physics Letters 82, 3110-2 (2003). |
|
[71] | F. Berthet, S. Petitdidier, Y. Guhel, J. Trolet, P. Mary, A. Vivier, C. Gaquiere, B. Boudart, “Analysis of degradation mechanisms in AlInN/GaN HEMTs by electroluminescence technique,” Solid State Electronics 127, 13-19 (2017). |
|
[72] | R. Pengelly, S. Wood, J. Milligan, S. Sheppard, W. Pribble, “A review of GaN on SiC high electron mobility power transistors and MMICs,” IEEE Transactions on Microwave Theory and Techniques 60, 1764-1783 (2012). |
|
[73] | G. Zhua, G. Lianga, Y. Zhoub, X. Chenc, X. Xuc, X. Fenga, A. Songa, “Reactive evaporation of SiOx films for passivation of GaN high electron mobility transistors,” Journal of Physics and Chemistry of Solids 129, 54-60 (2019). |
|
[74] | P. Upadhyay, M. Meer, K. Takhar, D. Khachariya, A. Kumar, D. Banerjeee, S. Ganguly, A. Laha, D. Saha, “Improved ohmic contact to GaN and AlGaN/GaN two dimensional electron gas using trap assisted tunneling by B implantation,” Physics Status Solidi B 252, 989-995 (2015). |
|
[75] | L. Zhang, J. Shi, H. Huang, X. Liu, S. Zhao, P. Wang, D. Zhang, “Low temperature ohmic contact formation in GaN high electron mobility transistors using microwave annealing,” Electronic Devices Letters 36, 896-898 (2015). |
|
[76] | Q. Feng, L. Li, Y. Hao, J. Ni, J. Zhang, “The improvement of ohmic contact of Ti/Al/Ni/Au to AlGaN/GaN HEMT by multi-step annealing method,” Solid State Electronics 53, 955-958 (2009). |
|
[77] | M. Lin, Z. Ma, F. Huang, Z. Fan, L. Allen, H. Morkoc, “Low resistance ohmic contacts on wide band gap GaN,” Applied Physics Letters 63, 1003-1005 (1993). |
|
[78] | P. Whiting, N. Rudawski, M. Holzworth, S. Pearton, K. Jones, L. Liub, T. Kang, F. Ren, “Nanocrack formation in AlGaN/GaN high electron mobility transistors utilizing Ti/Al/Ni/Au ohmic contacts,” Microelectronics Reliability 70, 41-481 (2017). |
|
[79] | A. Nadim, K. Dutta, “Analytical models for the 2DEG concentration and gate leakage current in AlGaN/GaN HEMTs,” Solid State Electronics 132, 64-72 (2017). |
|
[80] | C. Apurba, G. Saptarsi, M. Partha, J. Sanjay, D. Mukulika, B. Ankush, M. Mihir, K. Rahul, D. Subhashis, D. Palash, B. Dhrubes, “Reverse bias leakage current mechanism of AlGaN/InGaN/GaN heterostructure,” Electronic Materials Letters 12, 232-236 (2016). |
|
[81] | H. Liu, Z. Zhang, W. Luo, “Analysis of reverse gate leakage mechanism of AlGaN/GaN HEMTs with N2 plasma surface treatment,” Solid State Electronics 144, 60-66 (2018). |
|
[82] | H. Sun, M. Liu, P. Liu, X. Lin, X. Cui, J. Chen, D. Chen, “Performance optimization of lateral AlGaN/GaN HEMTs with cap gate on 150-mm silicon substrate,” Solid State Electronics 130, 28-32 (2017). |
|
[83] | G. Pavlidis, S. Pavlidis, E. Heller, E. Moore, R. Vetury, S. Graham, “Characterization of AlGaN/GaN HEMTs using gate resistance thermometry,” IEEE Transactions on Electron Devices 64, 78-83 (2017). |
|
[84] | Y. Chen, Y. Zhang, Y. Liu, X. Liao, Y. En, W. Fang, Y. Huang, “Effect of hydrogen on defects of AlGaN/GaN HEMTs characterized by low frequency noise,” IEEE Transactions on Electron Devices 65, 1321-1326 (2018). |
|
[85] | P. Prystawkoa, M. Sarzynskia, A. Nowakowska-Siwinskab, D. Crippac, P. Kruszewskia, W. Wojtasiakd, M. Leszczynskia, “AlGaN HEMTs on patterned resistive/conductive SiC templates,” Journal of Crystal Growth 464, 159-163 (2017). |
|
[86] | D. Zhang, X. Cheng, L. Zhenga, L. Shen, Q. Wang, Z. Gua, R. Qiana, D. Wu, W. Zhou, D. Cao, Y. Yua, “Effects of polycrystalline AlN filmon the dynamic performance of AlGaN/GaN high electron mobility transistors,” Materials and Design 148, 1-7 (2018). |
|
[87] | T. Koa, D. Lina, C. Lin, C. Chang, J. Zhang, S. Tud, “High-temperature carrier density and mobility enhancements in AlGaN/GaN HEMT using AlN spacer layer,” Journal of Crystal Growth 464, 175-179 (2017). |
|
[88] | W. Sasangka, G. Syaranamual, Y. Gaoa, R. I Made, C. Gana, C. Thompsona, “Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation,” Microelectronics Reliability 76, 287-291 (2017). |
|
[89] | S. Mahajan, A. Malik, R. Laishram, S. Vinayak, “Performance enhancement of gate annealed AlGaN/GaN HEMTs,” Journal of the Korean Physical Society 70, 533-538 (2017). |
|
[90] | S. Dhakad, N. Sharma, C. Periasamy, N. Chaturvedi, “Optimization of ohmic contacts on thick and thin AlGaN/GaN HEMTs structures,” Superlattices and Microstructures 111, 922-926 (2017). |
|
[91] | K. Takhar, M. Meer, B. Upadhyay, S. Ganguly, D. Saha, “Performance improvement and better scalability of wet-recessed and wet-oxidized AlGaN/GaN high electron mobility transistors,” Solid State Electronics 131, 39-44 (2017). |
|
[92] | A. Malik, C. Sharma, R. Laishram, R. Bag, D. Rawal, S. Vinayak, R. Sharma, “Role of AlGaN/GaN interface traps on negative threshold voltage shift in AlGaN/GaN HEMT,” Solid State Electronics 142, 8-13 (2018). |
|
[93] | Z. Bai, J. Du, Y. Liu, Q. Xin, Y. Liu, Q. Yu, “Study on the electrical degradation of AlGaN/GaN MIS-HEMTs induced by residual stress of SiNx passivation,” Solid State Electronics 133, 31-37 (2017). |
|
[94] | H. Sasaki, T. Hisaka, K. Kadoiwa, T. Okua, S. Onoda, T. Ohshima, E. Taguchi, H. Yasuda, “Ultra-high voltage electron microscopy investigation of irradiation induced displacement defects on AlGaN/GaN HEMTs,” Microelectronics Reliability 81, 312-319 (2018). |
|
[95] | B. Upadhyay, K. Takhar, J. Jha, S. Ganguly, D. Saha, “Surface stoichiometry modification and improved DC/RF characteristics by plasma treated and annealed AlGaN/GaN HEMTs,” Solid State Electronics 141, 1-6 (2018). |
|