eng Science and Education Publishing American Journal of Mechanical Engineering 2328-4110 2016-12-17 4 7 423 428 10.12691/ajme-4-7-35 AJME20164735 article Martin Hagara martin.hagara@tuke.sk 1 Róbert Huňady 1 Pavol Lengvarsky 1 Jozef Bocko 1 Department of Applied Mechanics and Mechanical Engineering, Faculty of Mechanical Engineering, Technical University of Košice, Košice, Slovakia The paper deals with the description of methodology for performing of drop test of smartphones using high-speed digital image correlation method. This method allows capturing the impact of the phone at high sampling frequencies and thus the stresses in each surface point can be computed. The measurement was realized in laboratory conditions, in which the phone was fallen down from the height of one meter, which is a distance, which the mobile phones are dropped out from the being's hand. Five different possibilities of the phone impact were investigated. The acquired results are in a form of deformation as well as von Mises stress computed in chosen locations of the touchscreen area. http://pubs.sciepub.com/ajme/4/7/35/ajme-4-7-35.pdf drop test stress analysis digital image correlation smartphone