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Seah, S. K. W., Lim, C. T., Wong, E. H. and Shim, V. P W., “Mechanical response of PCBs in portable electronic products during drop impact,” IEEE Xplore 4th Electronics Packaging Technology Conference, 2002.

has been cited by the following article:

Article

The Methodology for Realization of Smartphone Drop Test Using Digital Image Correlation

1Department of Applied Mechanics and Mechanical Engineering, Faculty of Mechanical Engineering, Technical University of Košice, Košice, Slovakia


American Journal of Mechanical Engineering. 2016, Vol. 4 No. 7, 423-428
DOI: 10.12691/ajme-4-7-35
Copyright © 2016 Science and Education Publishing

Cite this paper:
Martin Hagara, Róbert Huňady, Pavol Lengvarský, Jozef Bocko. The Methodology for Realization of Smartphone Drop Test Using Digital Image Correlation. American Journal of Mechanical Engineering. 2016; 4(7):423-428. doi: 10.12691/ajme-4-7-35.

Correspondence to: Martin  Hagara, Department of Applied Mechanics and Mechanical Engineering, Faculty of Mechanical Engineering, Technical University of Košice, Košice, Slovakia. Email: martin.hagara@tuke.sk

Abstract

The paper deals with the description of methodology for performing of drop test of smartphones using high-speed digital image correlation method. This method allows capturing the impact of the phone at high sampling frequencies and thus the stresses in each surface point can be computed. The measurement was realized in laboratory conditions, in which the phone was fallen down from the height of one meter, which is a distance, which the mobile phones are dropped out from the being’s hand. Five different possibilities of the phone impact were investigated. The acquired results are in a form of deformation as well as von Mises stress computed in chosen locations of the touchscreen area.

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