Heat transfer at nanoscale, e.g., temperature distribution in graphene and carbon nanotube, and at microscale, e.g., thermal transport in micro-reactors, has drawn great interest in recent years. Fundamental understanding of the underlined mechanisms of heat transfer at such small scales is the prerequisite to the efficient utilization of the associated characteristics. However, due to the intrinsic challenges in theoretical and experimental approaches, numerical simulation has played an indispensable role in the scientific study of heat transfer at nano- and microscale. The advantages of numerical simulation over theoretical and experimental approaches are, e.g., precise system control, non-intrusive quantity measurement, and cost-effective. The special issue aims to foster the development and application of numerical simulation for nano- and microscale heat transfer. Papers submitted to this special issue are expected to advance the state of the art of numerical simulation for nano- and microscale heat transfer.
We invite authors to submit original research and review papers on the numerical simulation of nano- and microscale heat transfer from all aspects. Research areas of nano-scale and microscale heat transfer within the scope of (but not limited to) material science, fluid mechanics, biology, energy, etc., are all welcome.
About the issue
The scope of topics covered in the this issue include:
- 1. Development and verification of numerical methods for nano- and microscale heat transfer, such as quantum mechanics, molecular dynamics, dissipative dynamics, direct simulation Monte Carlo, and lattice Boltzmann method, etc.
- 2. Computer realization and algorithm optimization of the numerical methods for nano- and microscale heat transfer.
- 3. Physical characterization and mechanism interpretation of the nano- and microscale heat transfer by numerical simulation.
- 4. Multi-scale coupling of different methods.
- 5. High performance computing of nano- and microscale heat transfer.
Submission Deadline: December 31, 2014
Notification of Acceptance: February 28, 2015
Final Version Due: April 30, 2015
Special Issue Publishing Date: May 31, 2015
Chief Guest Editor
Holland Computing Center, University of Nebraska Lincoln, United States
Department of Mechanical Engineering, Iowa State University, United States
Submit your article now
Manuscripts should be submitted as an attached file to an e-mail directed to the Chief Guest Editor, Jingchao Zhang at the address: <email@example.com>